All PCBs undergo an inspection which allows to identify the critical parts and prevent issues during the process.
Sensitive components and connectors are protected with heat resistant tape.
The PCBs are pre-baked for 48 hours, in order to eliminate the moisture within them.
The faulty component is removed and the PCB is cleaned from tin residues and prepared for refurbishment.
The new BGA is placed by means of special automated alignment instruments, which guarantee maximum precision.
The area which needs to be repaired is brought to fusion temperature by soldering the new component with the best fluxes, according to our team’s accurate selection.
Once the refurbished board is cooled, the new BGA is inspected and a solder quality check is carried out.
Upon completion of such phases, the new BGA undergoes a series of thermal cycling tests, so as to provide the customer with a tested, functioning and reliable device.